Details
Duplicates
Comments
Linked Resources
Tweet
University of Wisconsin-Madison Herbarium (WIS)
Catalog #:
WIS-F-0068299
Occurrence ID:
28373408-8106-41cd-b3d9-a7b44a258019
Taxon:
Dasyscypha resiniferus
Höhn.
Family:
Hyaloscyphaceae
Collector:
H. Sydow
Number:
s.n.
Date:
1906-11-04
Locality:
Exsiccati series:
Mycotheca Germanica #607
Specimen Images
Open Medium Image
Open Large Image
Usage Rights:
CC0 1.0 (Public-domain)
Record ID:
28373408-8106-41cd-b3d9-a7b44a258019
For additional information about this specimen, please contact: Kenneth M. Cameron (
kmcameron@wisc.edu
)
Current Record
H. Sydow s.n.
1906-11-04
Catalog #:
WIS-F-0068299
GUID:
28373408-8106-41cd-b3d9-a7b44a258019
Latest Identification:
Dasyscypha resiniferus
Höhn.
Associated Exsiccatae
USDA United States National Fungus Collections (BPI)
Sydow H.
1906-11-04
Catalog #:
BPI 656014
Latest Identification:
Hyaloscypha stevensonii
(Berk. & Broome) Nannf.
Show Full Details
USDA United States National Fungus Collections (BPI)
Sydow H.
1906-11-04
Catalog #:
BPI 662065
Latest Identification:
Dasyscyphus resiniferus
Höhn.
Show Full Details
Cornell University Plant Pathology Herbarium (CUP)
H. Sydow
1906-11-04
Catalog #:
Syd.,Myc.germ.0607
Latest Identification:
Dasyscypha resiniferus
Höhn.
Identified by:
H. Sydow
Show Full Details
Field Museum of Natural History (F)
H. Sydow s.n.
1906-11-04
Catalog #:
C0282133F
GUID:
d2d3346b-661a-47a9-9542-45c7869454ce
Latest Identification:
Dasyscyphus resiniferus Höhn.
Höhn.
Show Full Details
University of Nebraska State Museum, C.E. Bessey Herbarium - Fungi (NEB)
H. Sydow
1906-11-04
Catalog #:
NEB00050247
Latest Identification:
Dasyscypha resinifera
Show Full Details
Academy of Natural Sciences of Drexel University (PH)
H. Sydow s.n.
1906-11-04
Catalog #:
PH00315023
Latest Identification:
Hyaloscypha resinifera
(Höhn.) Boud.
Identified by:
Unknown
Unknown
Show Full Details
USDA United States National Fungus Collections (BPI)
Catalog #:
BPI 1026131
Latest Identification:
Dasyscyphus resiniferus
Höhn.
Show Full Details
No comments have been submitted
New Comment
Log In
to leave a comment